Imagine flexible electronic circuits capable of being shaped to fit specific objects or products created using 3D printing. This is now possible thanks to PCBend, an open-source process developed by two young researchers: one from the Inria-Loria project team MFX, and the other from the Institute of Science and Technology Austria. Their innovation is set to be unveiled at the next edition of the Siggraph global conference, which will run from the 6th to the 10th August 2023 in Los Angeles.
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